JPH0251261B2 - - Google Patents
Info
- Publication number
- JPH0251261B2 JPH0251261B2 JP9338983A JP9338983A JPH0251261B2 JP H0251261 B2 JPH0251261 B2 JP H0251261B2 JP 9338983 A JP9338983 A JP 9338983A JP 9338983 A JP9338983 A JP 9338983A JP H0251261 B2 JPH0251261 B2 JP H0251261B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- soldering
- transfer device
- rod
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 27
- 238000004140 cleaning Methods 0.000 claims description 25
- 230000032258 transport Effects 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000001035 drying Methods 0.000 description 8
- 239000000969 carrier Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Attitude Control For Articles On Conveyors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58093389A JPS59219985A (ja) | 1983-05-28 | 1983-05-28 | キヤリア水平反転移送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58093389A JPS59219985A (ja) | 1983-05-28 | 1983-05-28 | キヤリア水平反転移送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59219985A JPS59219985A (ja) | 1984-12-11 |
| JPH0251261B2 true JPH0251261B2 (en]) | 1990-11-06 |
Family
ID=14080951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58093389A Granted JPS59219985A (ja) | 1983-05-28 | 1983-05-28 | キヤリア水平反転移送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59219985A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8141766B1 (en) * | 2010-09-06 | 2012-03-27 | Cheng Uei Precision Industry Co., Ltd. | Automatic soldering system |
-
1983
- 1983-05-28 JP JP58093389A patent/JPS59219985A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59219985A (ja) | 1984-12-11 |
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